The MIT Microphotonics Center hosted a very successful IPSR-International 2026 Spring Meeting at MIT – “Building a Common Platform for Electronic-Photonic Integration”. Delivered in collaboration with MIT FUTUR-IC, MIT-MTL, and PhotonDelta, this year’s presentations, plenary sessions and Application Interest Group discussions brought together global industrial leaders, academic researchers, and R&D partners to accelerate the transition from lab to market.
Key highlights from the two-day event included:
🔹 System Requirements for AI & Datacenters: Keynotes from pioneers at Meta, NVIDIA, AMD, and Cisco mapping out the critical bandwidth density and performance metrics needed to scale future infrastructure.
🔹 Advancing CP-CIS: Shifting the Common Photonic Chiplet Integration Specification from a conceptual framework to a credible, industrially adoptable standard.
🔹 Design & Supply Chain Evolution: Driving EDA vendors to fully support cross-disciplinary electronic-photonic co-design while addressing the scaling bottlenecks of Co-Packaged Optics and High-Volume Manufacturing.
A huge thanks to our members, working group chairs, and the next-generation of manufacturing talent who joined us and help further define the next stage integration challenges and opportunities.
Stay tuned for an upcoming publication in the Microphotonics Center Newsletter detailing more highlights and roadmap session takeaways. All Microphotonics Center members will have access to cleared Meeting proceedings.
👉 Learn more about the roadmap and how to get involved with the Microphotonics Center and FUTUR-IC:
#IntegratedPhotonics #SemiconductorManufacturing #IPSR #FUTURIC #MITnano #WorkforceDevelopment #Photonics #AI #CoPackagedOptics